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24.7.3 Entry and Backup Materials Entry and backup material cost per stack (y) is determined by multiplying the stack size (square foot per panel [x]) by the cost per square foot. Remember to divide the backup cost by 2 since each backup panel may be used twice. Total material cost (aa) is calculated by multiplying cost per stack (y) by total number of drilled stacks (z).

24.7.4 Burden and Labor Using typical burden and labor rates per hour (ab), these values are multiplied by the number of hours to complete the job (determined in Table A) in order to calculate the total burden and labor costs (ac).

Fig 445: A close-up of the grinding and the turning of an aspheric lens glass on a Moore s nanotech 500FG

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24.7.5 Total Drilling Cost and Cost per Hole After entering the required data in Tables A through D of Fig. 24.11, the total drilling cost and the cost distribution (see Table E) as well as the drilling cost per panel and the cost per hole (see Table F) can be calculated. Because the cost per hole typically ranges around 1/10 of a cent, a more accurate and easier way to comprehend this value is by showing the average cost per 1000 holes, as is done in the cost model.

All AVR processors have 32 general-purpose registers. Some of these registers have additional special functions. The registers are named R0 through R31. The register file is broken up into 2 parts with 16 registers each, R0 to R15 and R16 to R31. All instructions that

As circuit density continues to increase along with the demand for higher and higher accuracy in hole location, the drilling machines and the environment in which the machines operate must be tightly controlled to achieve success in the drilling operation. High-density interconnect (HDI) has been defined as referring to holes with diameters of 0.006 in. or less. HDI holes were generally expected to be made by nonmechanical means, such as lasers, plasma, or photoimaging. However, most holes continue to be created by mechanical means, and as the hole size approaches or in some cases decreases to less than 0.004 in., special challenges face the mechanical drilling process. With the density increase, innerlayer registration is of utmost importance.Artwork generation and fabrication processes can introduce layer shift. This shift is particularly troublesome in high-layer-count printed circuit boards (PCBs). This chapter addresses these issues of small-hole drilling as well as layer-to-layer registration. In this chapter, holes created by traditional mechanical drilling methods are referred to as drilled, and the process is referred to as drilling. Holes created by laser, plasma, or photoimaging are not really drilled, even though the term is often used to describe them. When this chapter references nonmechanical via-hole creation processes, these are referred to by their specific type.

PCB technology requires holes as small as 0.002 in. (0.05 mm) to be drilled with extremely high accuracy, particularly when drilling dense hole patterns. The processes and machines used to drill these holes now constitute a highly developed science. As the drilling process approaches these HDI dimensions, numerous factors become increasingly critical, such as:

Vacuum Drill bit condition Dynamic spindle run-out Backup and entry material (type and thickness) Maximum spindle speed Depth control

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Although it is somewhat subjective, the decision to drill with mechanical or laser systems can be influenced by the following considerations:

Aspect ratio determination If the via to be formed is more than 0.016 in. (6.3 mm) deep, it is better to use a mechanical drilling process. Material type Materials that tend to have excess smearing that clogs the flutes in a mechanical system are usually better on a hybrid laser system. Size of holes If the hole to be drilled is larger than 0.008 in., then use a mechanical system for speed and hole wall quality.

Lasers for PCB Processing Several types of lasers can be used to fabricate PCBs, including:

operate on the registers have direct access and single-cycle access to all the registers. The exception is the SBCI, SUBI, CPI, ANDI, and ORI instructions as well as the LDI instruction. These instructions operate only on registers R16 to R31. Registers R0 and R26 through R31 have additional functions. R0 is used in the instruction LPM (load program memory), while R26 through R31 are used as pointer registers as illustrated in Figure 3.4. These pointer registers are used in many of the register indirect instructions.

Infrared (IR) (CO2) lasers (9.4 m to 10.6 m) Ultraviolet (UV) lasers for PCB YAG (yitrium-aluminum-garnet) YVO4 (yitrium-lithium-floride) See Fig. 25.1 for diagram of laser wavelengths by type.

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